[object Object]
  • image of System On Chip (SoC)>AGFB006R24D2I3V
  • image of System On Chip (SoC)>AGFB006R24D2I3V
AGFB006R24D2I3V
IC
-
Tray
1
:
:

3

$7,081.8048

$21,245.4144

image of System On Chip (SoC)>AGFB006R24D2I3V
image of System On Chip (SoC)>AGFB006R24D2I3V
AGFB006R24D2I3V
AGFB006R24D2I3V
System On Chip (SoC)
Intel
IC
-
Tray
0
Product parameters
TYPEDESCRIPTION
MfrIntel
SeriesAgilex F
PackageTray
Product StatusACTIVE
Package / Case2340-BFBGA Exposed Pad
Speed1.4GHz
RAM Size256KB
Number of I/O576
Operating Temperature-40°C ~ 100°C (TJ)
Core ProcessorQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary AttributesFPGA - 573K Logic Elements
ConnectivityEBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
PeripheralsDMA, WDT
Supplier Device Package2340-BGA (45x42)
ArchitectureMPU, FPGA
captcha

086-18054219561
0
[object Object]